Jetting

EMS utilizes the latest in solder jett printing technology. The solder jett process can be used for rapid prototype assembly eliminating the use of solder stencils. This jett technology can also be used for various other demanding applications such as Package-on-Package assemblies, Pin-in-Paste processes, as well as adding more paste to an assembly where a stencil is limited by it thickness (i.e. stepped stencils).

• Min dot size: Ø 0.4mm with T6 solder paste
• Speed up to 80’000 dots/h
• Placement accuracy XY dots: 51 μm @3σ
• Common solder paste type T4, T5, T6 and T7